The Defense Advanced Research Projects Agency (DARPA) is soliciting innovative proposals that enable compact cold-atom devices and environmentally-decoupled ultra-high Q microelectromechanical (MEMS) and photonics devices through microscale ultra-high-vacuum systems (µUHV).
The program aims to develop microscale ultra-high-vacuum (µUHV) systems that enable compact cold-atom devices and ultra-high Q MEMS and photonics devices. The work includes manufacturing micro-vacuum systems, reducing leaks, pumping out residual gasses, and measuring pressure within the micro-vacuum chamber. The program requires atomic source integration and maintaining vacuum integrity and atomic source performance for 3 years. Proposers must address high-volume manufacturing scalability and submit a comprehensive technical and cost proposal.
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Here’s what each costs through Light RFP if you need one.
Source: SAM.gov (notice 1a48d012be054236aa052eced9afeb04), retrieved via the SAM.gov Get Opportunities API. View the official posting, and always confirm requirements and deadlines with the issuing agency.