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Federal · SAM.gov · Washington, DC

Die Bonding and Vacuum Packaging System

Due Aug 7, 2026·10 days left·General ConstructionView official posting ↗
Issuing agency
Department of Defense
Method
Combined Synopsis/Solicitation
Category
NAICS 333993
PIN
N0017326QKN05
Location
Washington, DC
Posted
Jul 23, 2026
Takeaways by LightRFP AI

Generate a quick AI overview of this bid, pulled from its details and the attached documents.

Description

Please see attached combined synopsis/solicitation

This listing has limited details available. Please refer to the official posting for full scope, bonding requirements, submission instructions, and other bid details.

Documents2
Specifications - Die Bonding.pdfPDF
PreviewDownload
CSS N0017326QKN05 Die Bonding and Packaging.pdfPDF
PreviewDownload

Contact

Name
Kevin Nguyen
Address
DC 20375
Full source recordfrom SAM.gov
Hit
Id
159d85916a26499ea95d6ddbcc98cfb3
Type
Code
k
Value
Combined Synopsis/Solicitation
Type
opportunity
Award
Awardee
Title
Die Bonding and Vacuum Packaging System
R Score
0
Is Active
Yes
Is Canceled
No
Publish Date
Jul 23, 2026
Descriptions
Content
<p>Please see attached combined synopsis/solicitation</p>
Last Modified Date
Jul 23, 2026
Modified Date
Jul 23, 2026
Response Date
Aug 7, 2026
Modifications
Count
0
Response Time Zone
America/New_York
Response Date Actual
Aug 7, 2026
Solicitation Number
N0017326QKN05
Organization Hierarchy
Code
9700
Name
DEPT OF DEFENSE
Type
DEPARTMENT
Level
1
Status
active
Address
Organization Id
100000000
Code
1700
Name
DEPT OF THE NAVY
Type
AGENCY
Level
2
Status
active
Address
Organization Id
300000188
Code
ONR
Name
ONR
Type
MAJOR COMMAND
Level
3
Status
active
Address
Organization Id
100005042
Code
ONR NRL
Name
ONR NRL
Type
SUB COMMAND
Level
4
Status
active
Address
Organization Id
100005043
Code
N00173
Name
NAVAL RESEARCH LABORATORY
Type
OFFICE
Level
5
Status
active
Address
Zip
"20375-5328"
City
"WASHINGTON"
State
"DC"
Country
"USA"
Street Address
"4555 OVERLOOK AVE SW"
Organization Id
100255323
Type
Combined Synopsis/Solicitation
Title
Die Bonding and Vacuum Packaging System
Active
Yes
Detail
Type
k
Naics
Code
333993
Type
primary
Title
Die Bonding and Vacuum Packaging System
Archive
Date
Aug 22, 2026
Type
auto15
Version
2
Permissions
IVL
Read
Yes
Create
Yes
Delete
Yes
Update
Yes
Solicitation
Deadlines
Response
Aug 7, 2026
Response Tz
America/New_York
Organization Id
100255323
Point Of Contact
Type
primary
Email
kevin.nguyen3.civ@us.navy.mil
Full Name
KEVIN NGUYEN
Type
secondary
Email
jamie.l.dixon8.civ@us.navy.mil
Full Name
Jamie Dixon
Classification Code
3540
Place Of Performance
Zip
20375
State
Code
DC
Name
District of Columbia
Country
Code
USA
Name
UNITED STATES
Solicitation Number
N0017326QKN05
Additional Reporting
none
Ui Link
https://sam.gov/opp/159d85916a26499ea95d6ddbcc98cfb3/view
History
Links
Self
Href
https://86samdotgovopportunitiesmodern.prod.apps-internal.prod-iae.bsp.gsa.gov/opps/v2/opportunities/159d85916a26499ea95d6ddbcc98cfb3/history{?postedFrom}
Templated
Yes
History
Index
1
Title
Die Bonding and Vacuum Packaging System
Latest
1
Deleted
0
Action Date
2026-07-23T21:05:53.172+00
Action Type
publish
Posted Date
2026-07-23T21:05:53.17+00
Request Type
submit
Cancel Notice
0
Archive Notice
0
Opportunity Id
159d85916a26499ea95d6ddbcc98cfb3
Procurement Type
k
Solicitation Number
N0017326QKN05
Base Type
Combined Synopsis/Solicitation
Notice Id
159d85916a26499ea95d6ddbcc98cfb3
Naics Code
333993
Resources
Attachments
Name
"Specifications - Die Bonding.pdf"
Size
180097
Type
"file"
Mime Type
".pdf"
File Exists
"1"
Posted Date
"2026-07-23T21:05:53.17+00:00"
Resource Id
"c09b27cfce5d4dc083d8e0745a230f1e"
Access Level
"public"
Deleted Flag
"0"
Access Status
"public"
Attachment Id
"0875b4c73c314d51afb361fde8c2bad1"
Explicit Access
"0"
Attachment Order
2
Export Controlled
"0"
Name
"CSS N0017326QKN05 Die Bonding and Packaging.pdf"
Size
120874
Type
"file"
Mime Type
".pdf"
File Exists
"1"
Posted Date
"2026-07-23T21:05:53.17+00:00"
Resource Id
"88e6c664bc47447b936aef9b6c2ee3ea"
Access Level
"public"
Deleted Flag
"0"
Access Status
"public"
Attachment Id
"23e722c8bb0f4c019f8ad6c0edff7ea4"
Explicit Access
"0"
Attachment Order
1
Export Controlled
"0"
Opportunity Id
159d85916a26499ea95d6ddbcc98cfb3
Department
DEPARTMENT OF DEFENSE
Posted Date
Jul 23, 2026
Detail Fetched
Yes
Resource Links
https://sam.gov/api/prod/opps/v3/opportunities/resources/files/c09b27cfce5d4dc083d8e0745a230f1e/download?fn=Specifications%20-%20Die%20Bonding.pdf, https://sam.gov/api/prod/opps/v3/opportunities/resources/files/88e6c664bc47447b936aef9b6c2ee3ea/download?fn=CSS%20N0017326QKN05%20Die%20Bonding%20and%20Packaging.pdf
History Fetched
Yes
Point Of Contact
Type
primary
Email
kevin.nguyen3.civ@us.navy.mil
Full Name
KEVIN NGUYEN
Type
secondary
Email
jamie.l.dixon8.civ@us.navy.mil
Full Name
Jamie Dixon
Description Text
Please see attached combined synopsis/solicitation
Resources Fetched
Yes
Response Dead Line
Aug 7, 2026
Full Parent Path Name
DEPARTMENT OF DEFENSE.DEPARTMENT OF THE NAVY.ONR.ONR NRL.NAVAL RESEARCH LABORATORY
Place Of Performance
Zip
20375
State
Code
DC
Name
District of Columbia
Country
Code
USA
Name
UNITED STATES
Solicitation Number
N0017326QKN05

Source: SAM.gov (notice 159d85916a26499ea95d6ddbcc98cfb3), retrieved via the SAM.gov Get Opportunities API. View the official posting — always confirm requirements and deadlines with the issuing agency.

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